Capatect Kellerdämmplatte EPS 010

Basement ceiling insulation board made of expanded polystyrene rigid foam according to DIN EN 13163

LV Texte

Field of Application

Insulation board made of expanded polystyrene to be bonded to the underside of basement ceilings, to improve the thermal insulation of insufficiently insulated basement ceilings.

Material Properties

  • Application area ceiling: DI (underside ceiling insulation according to DIN 4108-10)
  • Quality protection according to BFA QS
  • Does not drip on burning
  • If deposited, free from shrinkage and dimensionally stable
  • Non-aging and diffusible
  • Toxicologically harmless
  • Free from CFC, HCFC, HFC and formaldehyd
  • Easy to process




Store dry and protected from moisture. Do not expose to UV radiation unprotected for a long time.

Heat conductivity

λR = 0.035 W/(m · K)

Resistance-count for diffusion µ (H2O)

20/40 as per DIN EN 12086

Resistance to thermal deformation

approx. 70° C, long term resistant

Raw density

22–24 kg/m³

Fire behaviour

Class E as per DIN EN 13501-1

Supplementary Product

Capatect Deckendämmschraube DDS-Z 618
Capatect Deckendämmstoffteller DDT 618/01
  • Usable dimensions: 980 x 480 mm = approx. 0.47 m2
  • External dimensions produced: 1,000 x 500 mm
  • Edges: shiplap formation
  • Chamfer: 7mm/ 45 degrees
  • Packaging units: see current delivery program

Suitable Substrates

Concrete, mineral substrates, old plaster, as well as stable old paintwork or coatings.

Substrate Preparation

The substrate must be level, clean, dry, firm, stable and free of any separating substances. Any protruding mortar ridges must be removed. Larger plaster cavities must be knocked off and plastered flush with the surface. Carefully remove dust, dirt and peeling paint. If necessary, prime the surface.


Approx. 2.12 boards/m2


Bonding is done with Capatect Klebe- und Spachtelmasse 190, Capatect Klebe- und Armierungsmasse 186M, Capatect Dämmkleber 185 or Disbomulti 209.

Divide the ceiling area into an even grid in order to achieve the same cutting widths on the sides. Then apply the adhesive to the back of the panel with a 10 x 10 mm notched trowel, if the substrate is absolutely flat.

Substrate tolerances can be compensated by applying the adhesive using the bead-point method. Adhesive contact area ≥ 40%.

Thanks to the all-round shiplap, the panels can be laid fold-in-fold with a sliding movement and light pressure, optionally in a bond with staggered joints or with cross joints. If the substrate is insufficiently suitable for adhesive bonding, 2 dowels per panel are to be placed in the board area.

Suitable dowels: Capatect Deckendämmschraube DDS-Z 618 in combination with Deckendämmstoffteller DDT.

The pore-structured white board surface can - depending on the design requirements - also be painted with emulsion paint.


Waste is to be avoided through careful cutting and further use. Any material residues, plastic (EAK 170203) or insulation material (EAK 170604), should be disposed of in accordance with the regulations.

Further information regarding recycling of insulation boards or adhesives: Contact local authorities.

Customer Service Centre

Tel.: +49 6154 71-71710
Fax: +49 6154 71-71711

International Distribution: Please see